Wafer3

1.1.1   WAFER DIE EJECT FEEDER (WDEF)

 

 

 

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The Wafer Die Eject Feeder is used to present bare dies and flip chips for placement from fixed and expanded wafers up to 8“ in diameter.

 

As Option to the WDEF are available:

 

Item

Specifications

Note

Space Need on Dovetail Plate

 

13

slots

 

Wafer Dimensions

 

3 - 8

 

Frame Dimensions

 

6,8

see section 1.1.2

Die Size:

min.

1 x 1

mm2

flipped

 

Min

0.5 x 0.5

mm2

direct pick (see with factory for smaller sizes)

 

max.

20 x 20

mm2

 

Wafer Rotation

max.

5

°

 

Vacuum on Die Ejector Set

 

< 300

mbar

 

Range

Needles

  • 0 - 2.6

mm

programmable

Positioning repeatability

X/Y

30

µm

 

 

Needles

20

µm

 

Camera FOV

 

 

 

17 x 22.8
10 x 13.4
5.7 x 7.6
2.3 x 3.7

 

 

mm2

 

 

manually adjustable

Stretcher Unit Changeover

<

5

min

 

Tip Changeover

<

30

s

 

Die Ejector Set Changeover

<

10

min

 

1.1.1.1   WDE Option: Heating Option for Eject Mechanism

Heats WDE die ejector set to a constant, regulated temperature, in order to facilitate die ejection.

 

Item

Specifications

Note

Temperature Range

up to

70

°C

 

Temperature Adjustment

manual

 

 

 

1.1.1.2   WDE Option: Automatic Wafer Cassette Handler WDE Option: Heating Option for Eject Mechanism

Wafer Cassette Elevator docks to the Wafer Die Ejector and allows to automatically load/ unload wafers on frames from a wafer cassette.

Item

Specifications

Note

Capacity

 

1

cassette

 

Magazine Size

max.

298x 278 x 250

mm3

(W x L x D)

Wafer Exchange

<

15

sec

Without hair dryer blow

Presence sensors

 

Frame

 

Optical

 

 

Cassette

 

Optical

1.1.1.3   WDE Option: Bar Code Reader WDE Option: Automatic Wafer Cassette Handler

The barcode reader is mounted on the base of the WDEF and used for wafer identification. 22 different codes are supported (e.g. Code 39, Code 128, 2/5 interleaved, Codabar)
 -The barcode must be located on the left side of the wafer frame

 

1.1.2   Expansion Unit WDE Option: Bar Code Reader

Each frame type requires a different expansion unit. Frame type must be specified at the time of order.

 

Frame Type

Wafer Size

Identical Types

ID(mm)

OD(mm)

FF-080

6”

ESEC 6”
K+S 6” 350-103
PP C1810
Motorola 6”

192.5

216

FF-105

8”

PP C2888
AP 15970-50
K+S 350-104

242.5

266.7

FF-108

8”

DTF2-8-1 (Disco)

250

276

FF-055

6”

DTF 2-6 (Disco)

175

195

Custom

 

 

 

 

 

 

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